Tainan
Taiwan
9
2016-08-25
The entities that hold a legal rights for patent applications filed by inventor Wang Dean:
Dean Wang from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Packages with stacked dies and methods of forming the same
#2 | 2016-06-09POP structures with dams encircling air gaps and methods for forming the same
#3 | 2015-05-21Through silicon via bonding structure
#4 | 2013-05-23Method for Stacking Devices and Structure Thereof
#5 | 2011-03-10Bonding metallurgy for three-dimensional interconnect
#6 | 2010-02-25Through silicon via bonding structure
#7 | 2010-01-21Bonding metallurgy for three-dimensional interconnect
#8 | 2009-12-31Method for stacking devices
#9 | 2008-11-20Semiconductor device and fabrication methods thereof
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