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Inventor profile of:

Stephan Grunow

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

Last publication date:

2016-07-07

Top Assignees for applications by Stephan Grunow

The entities that hold a legal rights for patent applications filed by inventor Grunow Stephan:

INTERNATIONAL BUSINESS MACHINES CORPORATION 19 ARMONK, NY United States
TEXAS INSTRUMENTS INCORPORATED 4 Dallas, TX United States
Chartered Semiconductor Manufacturing, Ltd. 1 Singapore, Singapore
GLOBALFOUNDRIES Inc. 1 Grand Cayman, Cayman Islands
Samsung Electronics Co., Ltd 1 , South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Gyeonggi-Do, South Korea

Recent patent applications by Grunow Stephan

Stephan Grunow from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-07-07

US20160197039A1

Electricity

Stacked via structure for metal fuse applications

#2 | 2015-08-20

US20150235946A1

Electricity

REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS

#3 | 2015-05-21

US20150137312A1

Electricity

Metal fuse structure for improved programming capability

#4 | 2014-06-19

US20140167772A1

Physics

Stacked via structure for metal fuse applications

#5 | 2014-03-13

US20140070362A1

Electricity

E-fuse structures and methods of manufacture

#6 | 2014-01-30

US20140028325A1

Physics

Stacked via structure for metal fuse applications

#7 | 2013-09-12

US20130234284A1

Electricity

Fuse and integrated conductor

#8 | 2013-08-22

US20130214894A1

Electricity

Metal fuse structure for improved programming capability

#9 | 2013-07-11

US20130176073A1

Electricity

Back-end electrically programmable fuse

#10 | 2013-05-23

US20130127584A1

Electricity

Redundant via structure for metal fuse applications

#11 | 2012-12-27

US20120326269A1

Electricity

E-fuse structures and methods of manufacture

#12 | 2012-10-04

US20120249159A1

Physics

Stacked via structure for metal fuse applications

#13 | 2010-08-19

US20100210098A1

Electricity

Self-aligned contact

#14 | 2010-02-18

US20100038793A1

Electricity

Interconnect structures comprising capping layers with low dielectric constants and methods of making the same

#15 | 2010-02-18

US20100038790A1

Electricity

Reliability of wide interconnects

#16 | 2009-12-03

US20090294973A1

Electricity

Interconnect structure for integrated circuits having improved electromigration characteristics

#17 | 2009-12-03

US20090294901A1

Electricity

Structure and method of forming electrically blown metal fuses for integrated circuits

#18 | 2009-10-22

US20090261453A1

Electricity

Air gap in integrated circuit inductor fabrication

#19 | 2009-10-15

US20090256263A1

Electricity

Structure and method for hybrid tungsten copper metal contact

#20 | 2009-07-02

US20090166865A1

Chemistry; metallurgy

Manufacturable reliable diffusion-barrier

#21 | 2009-04-16

US20090098728A1

Electricity

STRUCTURE CU LINER FOR INTERCONNECTS USING A DOUBLE-BILAYER PROCESSING SCHEME

#22 | 2009-04-02

US20090085210A1

Electricity

Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits

#23 | 2009-01-15

US20090017616A1

Electricity

Method for forming conductive structures

#24 | 2009-01-01

US20090001510A1

Electricity

Air gap in integrated circuit inductor fabrication

#25 | 2008-11-27

US20080290515A1

Electricity

Properties of metallic copper diffusion barriers through silicon surface treatments

InventorID:

257338 ⎘