Tokyo
Japan
13
2025-09-25
The entities that hold a legal rights for patent applications filed by inventor KATAGI Hideyuki:
Hideyuki KATAGI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
#2 | 2024-11-28PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD
#3 | 2022-05-26Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
#4 | 2022-02-17Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
#5 | 2022-02-17Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
#6 | 2021-02-25Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing
#7 | 2020-12-17Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
#8 | 2020-10-15Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
#9 | 2020-07-16Resin sheet and cured product of resin sheet
#10 | 2019-08-22Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
#11 | 2019-02-21Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product
#12 | 2019-02-07Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article
#13 | 2017-12-07Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
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