Poughkeepsie, New York
United States
12
2021-06-10
The entities that hold a legal rights for patent applications filed by inventor OSTRANDER Steve:
Steve OSTRANDER from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Spacer for die-to-die communication in an integrated circuit and method for fabricating the same
#2 | 2021-04-22Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
#3 | 2021-04-15Structure with controlled capillary coverage
#4 | 2021-04-15Fixture facilitating heat sink fabrication
#5 | 2020-10-15Mitigating cracking within integrated circuit (IC) device carrier
#6 | 2020-10-01Spacer for die-to-die communication in an integrated circuit
#7 | 2020-07-30Precision alignment of multi-chip high density interconnects
#8 | 2020-06-04Multiple chip carrier for bridge assembly
#9 | 2020-05-07Direct bonded heterogeneous integration packaging structures
#10 | 2020-04-30Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
#11 | 2019-09-26Direct bonded heterogeneous integration packaging structures
#12 | 2019-08-22Fixture facilitating heat sink fabrication
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