Kosuke TSUDA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-06-13

Top Assignees for applications by Kosuke TSUDA

The entities that hold a legal rights for patent applications filed by inventor TSUDA Kosuke:

Panasonic Intellectual Property Management Co., Ltd. 4 Osaka, Japan

Recent patent applications by TSUDA Kosuke

Kosuke TSUDA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-13

US20240190112A1

Performing operations; transporting

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

#2 | 2023-06-22

US20230193024A1

Chemistry; metallurgy

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

#3 | 2021-03-18

US20210084757A1

Electricity

Metal-clad laminate, metal foil with resin, and wiring board

#4 | 2020-01-02

US20200001573A1

Performing operations; transporting

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

InventorID:

2600969 ⎘