Hsinchu
Taiwan
46
2026-04-30
The entities that hold a legal rights for patent applications filed by inventor Loh Wei-Yip:
Wei-Yip Loh from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SILICIDE REGIONS AND THE METHODS OF FORMING THE SAME
#2 | 2026-03-05SEMICONDUCTOR STRUCTURE WITH SIDEWALL-FREE DIPOLE METAL FEATURE AND METHOD FOR MANUFACTURING THE SAME
#3 | 2025-12-18SEMICONDUCTOR INTERCONNECTION STRUCTURES AND MANUFACTURING METHOD THEREOF
#4 | 2025-11-20SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURES AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE
#5 | 2025-09-11Contact with a Silicide Region
#6 | 2025-09-11SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7 | 2025-07-31Conductive Structures and Dielectric Structures in Interconnect Structures
#8 | 2025-07-17Contact Structures in Semiconductor Devices
#9 | 2025-05-15METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICIDE REGIONS
#10 | 2025-02-20CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD
#11 | 2024-12-05SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#12 | 2024-11-14SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
#13 | 2024-10-03CONDUCTIVE FEATURE FORMATION AND STRUCTURE
#14 | 2024-09-05SELECTIVE SILICIDE FOR STACKED MULTI-GATE DEVICE
#15 | 2024-04-25Barrier-Free Approach for Forming Contact Plugs
#16 | 2024-04-25Semiconductor device pre-cleaning
#17 | 2023-12-21SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
#18 | 2023-12-21Buried conductive structure in semiconductor substrate
#19 | 2023-12-14SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE
#20 | 2023-11-16Method of manufacturing semiconductor devices with multiple silicide regions
#21 | 2023-11-16Deposition window enlargement
#22 | 2023-09-21SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURES AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE
#23 | 2023-08-17Selective dual silicide formation
#24 | 2023-07-20SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#25 | 2023-06-15Treatment for adhesion improvement
#26 | 2023-02-23Selective dual silicide formation
#27 | 2022-11-17Contact with a Silicide Region
#28 | 2022-10-13Semiconductor device pre-cleaning
#29 | 2022-09-15Semiconductor devices with stacked silicide regions
#30 | 2022-09-01Contact structure for semiconductor device and method
#31 | 2022-09-01Barrier-free approach for forming contact plugs
#32 | 2022-05-12Ammonium fluoride pre-clean protection
#33 | 2021-12-30Deposition window enlargement
#34 | 2021-09-23Conductive feature formation and structure
#35 | 2021-04-22Contact structure for semiconductor device and method
#36 | 2021-02-04Method of manufacturing semiconductor devices with multiple silicide regions
#37 | 2021-02-04Barrier-free approach for forming contact plugs
#38 | 2020-12-10Treatment for adhesion improvement
#39 | 2020-05-14Contact with a silicide region
#40 | 2020-04-09Method for forming semiconductor contact structure
#41 | 2020-03-12Semiconductor structure
#42 | 2020-01-02Treatment for adhesion improvement
#43 | 2019-09-05Method of forming a contact with a silicide region
#44 | 2019-09-05Contact structure and the method of forming the same
#45 | 2019-09-05Conductive feature formation and structure
#46 | 2019-05-16Semiconductor structure and method for manufacturing the same
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