Ming-Fa Chen

SEMICONDUCTOR PACKAGE WITH ADIABATIC WELL STRUCTURE

OPTICAL DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

Semiconductor Die Connection System and Method

PACKAGE STRUCTURE FOR HEAT DISSIPATION

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

DIE ON DIE BONDING STRUCTURE

SEMICONDUCTOR PACKAGING AND METHODS OF FORMING SAME

PACKAGE

SEMICONDUCTOR STRUCTURE

METHODS OF FABRICATING PACKAGE STRUCTURE

Structure and method for forming integrated high density MIM capacitor

Package-on-package device

Semiconductor package and manufacturing method of semiconductor package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Package and manufacturing method thereof

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Bonding Structure of Dies with Dangling Bonds

Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features

BUFFER DESIGN FOR PACKAGE INTEGRATION

Semiconductor packages

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

Semiconductor structure

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Package structure

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Molded Dies in Semiconductor Packages and Methods of Forming Same

Methods of fabricating the same die stack structure and semiconductor structure

PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

SEAL RING FOR HYBRID-BOND

Multi-Liner TSV Structure and Method Forming Same

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE

Package structure with photonic die and method

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Packaged device including an optical path structure aligned to an optical feature

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Bonding to alignment marks with dummy alignment marks

Integrated circuit package and method

PACKAGE STRUCTURE

Bonding structure and method of forming same

Passivation scheme design for wafer singulation

Semiconductor Device and Method of Manufacture

Semiconductor die, manufacturing method thereof, and semiconductor package

Stacking structure, package structure and method of fabricating the same

Package having different metal densities in different regions and manufacturing method thereof

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer

PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE

Semiconductor packages

Methods of forming semiconductor device packages having alignment marks on a carrier substrate

Method of manufacturing integrated circuit having through-substrate via

SEMICONDUCTOR STRUCTURE HAVING PHOTONIC DIE AND ELECTRONIC DIE

Semiconductor packages and methods of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor Packages Including Mixed Bond Types and Methods of Forming Same

Manufacturing method of semiconductor structure

Semiconductor die connection system and method

Package structure for heat dissipation

Integrated circuit package and method of forming thereof

Package structure

Package

Semiconductor structure and manufacturing method thereof

Package and manufacturing method thereof

Package and method of forming the same

System and method for aligned stitching

Bonding structure and method of forming same

Semiconductor package and method for manufacturing the same

Packages with Si-substrate-free interposer and method forming same

Semiconductor package and manufacturing method thereof

Package and method of fabricating the same

Package structure and method of manufacturing the same

Seal ring between interconnected chips mounted on an integrated circuit

Process control for package formation

Seamless bonding layers in semiconductor packages and methods of forming the same

Package having multiple chips integrated therein and manufacturing method thereof

Integrated circuit packages and methods of forming the same

Method of fabricating package structure

METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT

Integrated circuit packages

Semiconductor structure and semiconductor die

Semiconductor package

INTEGRATED CIRCUITS

Semiconductor package and manufacturing method of semiconductor package

Simplified Carrier Removable by Reduced Number of CMP Processes

Semiconductor Packaging and Methods of Forming Same

Semiconductor device and method of manufacture

Die on die bonding structure

Passivation scheme design for wafer singulation

Seal ring for hybrid-bond

Packages with Si-substrate-free interposer and method forming same

Semiconductor device and method having a through substrate via and an interconnect structure

Semiconductor Devices with System on Chip Devices

Package structures

Inactive Structure on SOIC

Semiconductor devices and methods of manufacture

Semiconductor device and method of manufacture