Wuhan
China
74
2025-11-27
The entities that hold a legal rights for patent applications filed by inventor Liu Jun:
Jun Liu from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME
#2 | 2025-10-30BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME
#3 | 2025-09-04MULTIPLE-STACK THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF
#4 | 2024-08-22BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME
#5 | 2024-07-25BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME
#6 | 2024-05-30MULTIPLE-STACK THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF
#7 | 2023-08-10UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS MEMORIES AND METHODS FOR FORMING THE SAME
#8 | 2023-04-20Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same
#9 | 2023-03-09Method for tilting characterization by microscopy
#10 | 2022-03-24Bonded unified semiconductor chips and fabrication and operation methods thereof
#11 | 2022-03-03Bonded semiconductor devices having processor and static random-access memory and methods for forming the same
#12 | 2022-02-24Semiconductor devices having adjoined via structures formed by bonding and methods for forming the same
#13 | 2022-02-10Channel hole and bitline architecture and method to improve page or block size and performance of 3D NAND
#14 | 2022-01-27Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same
#15 | 2022-01-13Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof
#16 | 2021-12-16Three-dimensional memory device with three-dimensional phase-change memory
#17 | 2021-11-25Three-dimensional memory devices and fabricating methods thereof
#18 | 2021-09-30Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same
#19 | 2021-09-23Method and corresponding apparatus for reducing backlight crosstalk impact of optical assembly
#20 | 2021-09-23Methods for forming semiconductor devices bonded by interposer structure
#21 | 2021-08-26Integration of three-dimensional NAND memory devices with multiple functional chips
#22 | 2021-08-26Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same
#23 | 2021-07-29Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same
#24 | 2021-07-08Three-dimensional memory device with embedded dynamic random-access memory
#25 | 2021-07-01Bonded semiconductor devices having processor and static random-access memory and methods for forming the same
#26 | 2021-06-10Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same
#27 | 2021-05-27Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof
#28 | 2021-05-20Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same
#29 | 2021-05-20Three-dimensional memory device with three-dimensional phase-change memory
#30 | 2021-05-06Stacked connections in 3D memory and methods of making the same
#31 | 2021-05-06Stacked connections in 3D memory and methods of making the same
#32 | 2021-05-06Semiconductor devices having adjoined via structures formed by bonding and methods for forming the same
#33 | 2021-04-22Stacked connections in 3D memory and methods of making the same
#34 | 2021-04-22Memory device using comb-like routing structure for reduced metal line loading
#35 | 2021-04-15Methods for forming three-dimensional phase-change memory devices
#36 | 2021-04-15Spacial arrangments of and critical dimensions for bit line contacts of three-dimensional phase-change memory devices
#37 | 2021-04-15Methods and structures for die-to-die bonding
#38 | 2021-04-15Semiconductor devices having interposer structure with adhesive polymer and methods for forming the same
#39 | 2021-04-15Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof
#40 | 2021-04-08Three-dimensional memory devices and fabrication methods thereof
#41 | 2021-03-25Stacked connections in 3D memory and methods of making the same
#42 | 2021-03-25Three-dimensional memory devices and fabrication methods thereof
#43 | 2021-03-25Three-dimensional memory devices with architecture of increased number of bit lines
#44 | 2021-03-11Bonded semiconductor devices having processor and static random-access memory and methods for forming the same
#45 | 2021-02-11Multiple-stack three-dimensional memory device and fabrication method thereof
#46 | 2020-12-03Three-dimensional memory devices with stacked device chips using interposers
#47 | 2020-12-03Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
#48 | 2020-11-05Bonded unified semiconductor chips and fabrication and operation methods thereof
#49 | 2020-11-05Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same
#50 | 2020-11-05Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same
#51 | 2020-11-05Three-dimensional memory device with three-dimensional phase-change memory
#52 | 2020-11-05BONDED MEMORY DEVICES HAVING FLASH MEMORY CONTROLLER AND FABRICATION AND OPERATION METHODS THEREOF
#53 | 2020-11-05Three-dimensional memory device with embedded dynamic random-access memory
#54 | 2020-10-15Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same
#55 | 2020-10-15Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same
#56 | 2020-10-15Integration of three-dimensional NAND memory devices with multiple functional chips
#57 | 2020-10-15Unified semiconductor devices having programmable logic device and heterogeneous memories and methods for forming the same
#58 | 2020-10-15Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same
#59 | 2020-10-15Stacked three-dimensional heterogeneous memory devices and methods for forming the same
#60 | 2020-09-03Three-dimensional memory devices with architecture of increased number of bit lines
#61 | 2020-08-20Channel hole and bitline architecture and method to improve page or block size and performance of 3D NAND
#62 | 2020-08-13Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
#63 | 2020-07-23Source contact structure of three-dimensional memory devices and fabrication methods thereof
#64 | 2020-07-23Three-dimensional memory devices and methods for forming the same
#65 | 2020-06-04Memory device using comb-like routing structure for reduced metal line loading
#66 | 2020-05-28Three-dimensional memory devices and fabricating methods thereof
#67 | 2020-05-28Three-dimensional memory devices and fabrication methods thereof
#68 | 2020-05-28Three-dimensional memory devices and fabrication methods thereof
#69 | 2020-03-19Three-dimensional memory devices and methods for forming the same
#70 | 2020-02-20Stacked connections in 3D memory and methods of making the same
#71 | 2020-02-20Methods and operating a 3D memory device
#72 | 2020-02-13Memory device and forming method thereof
#73 | 2020-01-30Multiple-stack three-dimensional memory device and fabrication method thereof
#74 | 2020-01-02Three-dimensional memory devices with stacked device chips using interposers
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