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Inventor profile of:

Junjun LIU

City:

Albany, New York

Country:

United States

Published Applications:

6

Last publication date:

2020-02-06

Top Assignees for applications by Junjun LIU

The entities that hold a legal rights for patent applications filed by inventor LIU Junjun:

  • SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD 3 Shenzhen, China
  • Shenzhen Xiuyuan Electronic Technology Co., Ltd 3 Guangdong, China
  • Shenzhen Xiuyuan Electronic Technology Co., Ltd. 2 Shenzhen, Guangdong, China
  • SHENZHEN XlUYUAN ELECTRONIC TECHNOLOGY CO., LTD 1 Shenzhen, China

Recent patent applications by LIU Junjun

Junjun LIU from Albany, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-02-06
US20200043886A1
Electricity

Integrated circuit packaging method and integrated packaging circuit

#2 | 2020-01-02
US20200006310A1
Electricity

Integrated circuit system and packaging method therefor

#3 | 2019-10-24
US20190326261A1
Electricity

Integrated circuit multichip stacked packaging structure and method

#4 | 2019-10-24
US20190326207A1
Electricity

Integrated circuit packaging method and integrated packaged circuit

#5 | 2019-09-26
US20190295982A1
Electricity

Chip wiring method and structure

#6 | 2019-09-19
US20190287909A1
Electricity

Integrated circuit packaging structure and method

InventorID:

2605567 ⎘

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