Osaka
Japan
6
2026-01-01
The entities that hold a legal rights for patent applications filed by inventor OGIHARA Yusuke:
Yusuke OGIHARA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
HIGH-MOLECULAR COMPOUND, MOLDING COMPOSITION, FILM AND CAPACITOR
#2 | 2025-01-23HIGH-MOLECULAR COMPOUND, MOLDING COMPOSITION, FILM, AND CAPACITOR
#3 | 2023-01-12HEAT TRANSFER DEVICE
#4 | 2022-12-15DIELECTRIC COMPOSITION, DIELECTRIC FILM, AND CAPACITOR
#5 | 2021-09-30Fluid heating device, motor system, movable object, and hydraulic system
#6 | 2020-01-09Wavelength conversion member, light source and lighting device
2610198 ⎘