Kanagawa
Japan
8
2024-12-05
The entities that hold a legal rights for patent applications filed by inventor Okada Kana:
Kana Okada from Kanagawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH PRESSURE GAS CONTAINER
#2 | 2024-12-05EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER
#3 | 2018-04-12MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD
#4 | 2018-04-12Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method
#5 | 2018-03-08Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resin
#6 | 2018-02-22MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, AND CIRCUIT PATTERN FORMING METHOD
#7 | 2017-08-10Composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method
#8 | 2013-05-23Laminate film
261663 ⎘