Radebeul
Germany
19
2025-09-04
The entities that hold a legal rights for patent applications filed by inventor Grillberger Michael:
Michael Grillberger from Radebeul, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
CAPACITIVE JUNCTION BETWEEN CONDUCTIVE LINE AND CONDUCTIVE PILLAR WITH METHODS TO FORM SAME
#2 | 2023-12-14REFLECTIVE SEMICONDUCTOR DEVICE WITH MIRROR ELEMENTS HAVING TWO OXIDE LAYERS OVER ALUMINUM LAYER, AND RELATED METHOD
#3 | 2016-06-30Methods of forming 3-D integrated semiconductor devices having intermediate heat spreading capabilities
#4 | 2013-05-23REDUCING PATTERNING VARIABILITY OF TRENCHES IN METALLIZATION LAYER STACKS WITH A LOW-K MATERIAL BY REDUCING CONTAMINATION OF TRENCH DIELECTRICS
#5 | 2012-03-153-D integrated semiconductor device comprising intermediate heat spreading capabilities
#6 | 2012-03-01Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems
#7 | 2012-03-01Stress reduction in chip packaging by using a low-temperature chip-package connection regime
#8 | 2012-01-05Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features
#9 | 2012-01-05Semiconductor device comprising through hole vias having a stress relaxation mechanism
#10 | 2011-12-01Stress reduction in chip packaging by a stress compensation region formed around the chip
#11 | 2011-10-06Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime
#12 | 2011-09-01Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts
#13 | 2010-10-07SEMICONDUCTOR DEVICE COMPRISING A CHIP INTERNAL ELECTRICAL TEST STRUCTURE ALLOWING ELECTRICAL MEASUREMENTS DURING THE FABRICATION PROCESS
#14 | 2010-05-06SEMICONDUCTOR DEVICE COMPRISING A DISTRIBUTED INTERCONNECTED SENSOR STRUCTURE FOR DIE INTERNAL MONITORING PURPOSES
#15 | 2010-03-04Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability
#16 | 2010-03-043-D integrated semiconductor device comprising intermediate heat spreading capabilities
#17 | 2009-12-03SEMICONDUCTOR DEVICE COMPRISING METAL LINES WITH A SELECTIVELY FORMED DIELECTRIC CAP LAYER
#18 | 2009-10-01Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics
#19 | 2009-06-04Method and test structure for monitoring CMP processes in metallization layers of semiconductor devices
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