Daisuke USA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2021-07-01

Top Assignees for applications by Daisuke USA

The entities that hold a legal rights for patent applications filed by inventor USA Daisuke:

Daisuke USA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Molded article and method for manufacturing molded article

LAMINATE, MOLDED ARTICLE AND METHOD FOR PRODUCING SAME

TRANSFER MOLD RELEASING FILM AND METHOD FOR MANUFACTURING MATTE MOLDED BODY

InventorID:

2627485 ⎘