Shingo SUDO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2021-01-21

Top Assignees for applications by Shingo SUDO

The entities that hold a legal rights for patent applications filed by inventor SUDO Shingo:

Shingo SUDO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device

Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method

Semiconductor device

Semiconductor device with thermoplastic resin to reduce warpage

InventorID:

2631569 ⎘