Daniel Brodoceanu

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

Detection of force applied by pick-up tool for transferring semiconductor devices

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

Application of underfill via centrifugal force

Probe card for efficient screening of highly-scaled monolithic semiconductor devices

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

MICROLENS ARRAYS FOR PARALLEL MICROPATTERNING

Flexible interconnect using conductive adhesive

Microlens arrays for parallel micropatterning

Magnetic clamping interconnects

Bonding dummy electrodes of light emitting diode chip to substrate

Bonding corners of light emitting diode chip to substrate using laser

Curved pillar interconnects

Etchant-accessible carrier substrate for display manufacture

USING UNDERFILL OR FLUX TO PROMOTE PLACING AND PARALLEL BONDING OF LIGHT EMITTING DIODES

Atomic force microscopy tips for interconnection

Selectively bonding light-emitting devices via a pulsed laser

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Curing pre-applied and plasma-etched underfill via a laser

Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers

Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers

Fabricating parabolic-shaped LEDs

Bridge pick-up head for transferring semiconductor devices

Rigid pickup head with conformable layer

Using underfill or flux to promote placing and parallel bonding of light emitting diodes

Optics formation using pick-up tools

Laser lift-off masks

Elastomeric layer fabrication for light emitting diodes