Taketoshi MAEDA

City:

Hiroshima

Country:

Japan

Published Applications:

Last publication date:

2021-06-24

Top Assignees for applications by Taketoshi MAEDA

The entities that hold a legal rights for patent applications filed by inventor MAEDA Taketoshi:

Taketoshi MAEDA from Hiroshima, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Packaging of a semiconductor device with dual sealing materials

Packaging of a semiconductor device with dual sealing materials

InventorID:

2638692 ⎘