Inventor profile of:

Thomas NEYER

City:

Munich

Country:

Germany

Published Applications:

20

Last publication date:

2026-04-02

Top Assignees for applications by Thomas NEYER

The entities that hold a legal rights for patent applications filed by inventor NEYER Thomas:

Recent patent applications by NEYER Thomas

Thomas NEYER from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-02
US20260096436A1
Electricity

POWER DEVICE INCLUDING METAL LAYER

#2 | 2026-03-05
US20260068216A1
Electricity

POWER DEVICE WITH GRADED CHANNEL

#3 | 2024-04-11
US20240119206A1
Physics

SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT

#4 | 2023-08-10
US20230253460A1
Electricity

MOSFET device with undulating channel

#5 | 2023-07-06
US20230215941A1
Electricity

POWER DEVICE WITH GRADED CHANNEL

#6 | 2023-01-05
US20230004700A1
Physics

Systems and methods for designing a discrete device product

#7 | 2022-11-10
US20220359426A1
Electricity

POWER DEVICE INCLUDING METAL LAYER

#8 | 2022-09-08
US20220285248A1
Electricity

Vertical transistors with gate connection grid

#9 | 2022-07-14
US20220223691A1
Electricity

MOSFET device with undulating channel

#10 | 2022-06-23
US20220199764A1
Electricity

Termination structures with reduced dynamic output capacitance loss

#11 | 2021-06-17
US20210183788A1
Electricity

Power device including metal layer

#12 | 2021-05-06
US20210134997A1
Electricity

Power device with graded channel

#13 | 2021-04-22
US20210118666A1
Electricity

Semiconductor substrate singulation systems and related methods

#14 | 2021-04-22
US20210117598A1
Physics

Systems and methods for designing a discrete device product

#15 | 2020-07-30
US20200243337A1
Electricity

Semiconductor wafer thinning systems and related methods

#16 | 2020-04-09
US20200111776A1
Electricity

Diode with current sensor

#17 | 2020-02-06
US20200044031A1
Electricity

Carbon-controlled ohmic contact layer for backside ohmic contact on a silicon carbide power semiconductor device

#18 | 2019-11-28
US20190362960A1
Electricity

Semiconductor substrate singulation systems and related methods

#19 | 2019-10-24
US20190326117A1
Electricity

Semiconductor wafer thinning systems and related methods

#20 | 2019-08-20
US15958123
Electricity

Semiconductor wafer thinning systems and related methods

InventorID:

2638812 ⎘