Munich
Germany
20
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor NEYER Thomas:
Thomas NEYER from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
POWER DEVICE INCLUDING METAL LAYER
#2 | 2026-03-05POWER DEVICE WITH GRADED CHANNEL
#3 | 2024-04-11SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
#4 | 2023-08-10MOSFET device with undulating channel
#5 | 2023-07-06POWER DEVICE WITH GRADED CHANNEL
#6 | 2023-01-05Systems and methods for designing a discrete device product
#7 | 2022-11-10POWER DEVICE INCLUDING METAL LAYER
#8 | 2022-09-08Vertical transistors with gate connection grid
#9 | 2022-07-14MOSFET device with undulating channel
#10 | 2022-06-23Termination structures with reduced dynamic output capacitance loss
#11 | 2021-06-17Power device including metal layer
#12 | 2021-05-06Power device with graded channel
#13 | 2021-04-22Semiconductor substrate singulation systems and related methods
#14 | 2021-04-22Systems and methods for designing a discrete device product
#15 | 2020-07-30Semiconductor wafer thinning systems and related methods
#16 | 2020-04-09Diode with current sensor
#17 | 2020-02-06Carbon-controlled ohmic contact layer for backside ohmic contact on a silicon carbide power semiconductor device
#18 | 2019-11-28Semiconductor substrate singulation systems and related methods
#19 | 2019-10-24Semiconductor wafer thinning systems and related methods
#20 | 2019-08-20Semiconductor wafer thinning systems and related methods
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