Jock T. BOVINGTON

Laserless optical transceiver

Laserless optical transceiver

Heatsinking in laser devices

Coupling multiple optical channels using a z-block

Pluggable optical modules with blind mate optical connectors and particular opto-electronic configuration

Configurable link extender in small form factor

Solder reflow compatible connections between optical components

Coupling multiple optical channels using a Z-block

Coupling multi-channel laser to multicore fiber

Laser and photonic chip integration

Package self-heating using multi-channel laser

Laser side mode suppression ratio control

Coupling multi-channel laser to multicore fiber

Laser and photonic chip integration

III-V laser platforms on silicon with through silicon vias by wafer scale bonding

SELECTIVE-AREA GROWTH OF III-V MATERIALS FOR INTEGRATION WITH SILICON PHOTONICS

Thermal isolation element

Solder reflow compatible connections between optical components

Fiber coupler with an optical window

Thermal isolation element

Variable confinement hybrid oscillator power amplifier

Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips

Passive fiber to chip coupling using post-assembly laser patterned waveguides

Quantum dot slab-coupled optical waveguide emitters

III-V laser platforms on silicon with through silicon vias by wafer scale bonding

Laser integration into a silicon photonics platform

III-V component with multi-layer silicon photonics waveguide platform

Laser sparing for photonic chips

Photonic integrated circuit bonded with interposer

Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips

Submount for semiconductor laser and optical fibers

Gain integration in Si photonic coherent modulators

Fiber coupler with an optical window

Photonic integrated circuit bonded with interposer