Daisuke TERADA

City:

Narashino-shi

Country:

Japan

Published Applications:

Last publication date:

2020-02-27

Top Assignees for applications by Daisuke TERADA

The entities that hold a legal rights for patent applications filed by inventor TERADA Daisuke:

TOYO ALUMINIUM KABUSHIKI KAISHA 1 Osaka-shi, Japan
KOIWAI CO., LTD. 1 Odawara-shi, Japan
KOIWAI CO., LTD. 1 Odawara, Japan
TOYO ALUMINUM KABUSHIKI KAISHA 1 Osaka, Japan

Recent patent applications by TERADA Daisuke

Daisuke TERADA from Narashino-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-02-27

US20200063241A1

Chemistry; metallurgy

High-strength aluminum alloy laminated molding and production method therefor

InventorID:

2655256 ⎘