HSINCHU
Taiwan
22
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor HE JUN:
JUN HE from HSINCHU, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
COOLING SYSTEMS FOR COMPUTER SYSTEM COMPONENTS AND METHODS OF OPERATING THE SAME
#2 | 2025-11-27GRAPHENE-CLAD METAL INTERCONNECT
#3 | 2025-11-27REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
#4 | 2025-11-20SEMICONDUCTOR PACKAGING
#5 | 2025-10-16SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#6 | 2025-02-27SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#7 | 2024-11-14SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#8 | 2024-10-31Method and device for wafer-level testing
#9 | 2024-09-19Method and system for wafer-level testing
#10 | 2024-02-22REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
#11 | 2024-02-01FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
#12 | 2023-12-28SEMICONDUCTOR PACKAGING
#13 | 2023-12-14GRAPHENE-CLAD METAL INTERCONNECT
#14 | 2023-11-16Method and device for wafer-level testing
#15 | 2023-08-10Method and system for wafer-level testing
#16 | 2022-10-13Method and device for wafer-level testing
#17 | 2022-10-06Semiconductor structure and manufacturing method of the same
#18 | 2021-11-18Stacked semiconductor devices and methods of forming thereof
#19 | 2021-10-07Method and system for wafer-level testing
#20 | 2021-07-01Method and device for wafer-level testing
#21 | 2020-04-02Dicing method for stacked semiconductor devices
#22 | 2020-02-27Method and system for wafer-level testing
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