Junfeng CUI

City:

Dalian, Liaoning

Country:

China

Published Applications:

Last publication date:

2021-03-18

Top Assignees for applications by Junfeng CUI

The entities that hold a legal rights for patent applications filed by inventor CUI Junfeng:

DALIAN UNIVERSITY OF TECHNOLOGY 2 Liaoning, China

Recent patent applications by CUI Junfeng

Junfeng CUI from Dalian, Liaoning, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-03-18

US20210080361A1

Physics

Method of in-situ TEM nanoindentation for damaged layer of silicon

#2 | 2020-03-12

US20200080921A1

Physics

Self-healing method for fractured SiC single crystal nanowires

InventorID:

2671036 ⎘