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Inventor profile of:

XIANG MA

City:

SPRING, Texas

Country:

United States

Published Applications:

Last publication date:

2024-07-25

Top Assignees for applications by XIANG MA

The entities that hold a legal rights for patent applications filed by inventor MA XIANG:

Hewlett-Packard Development Company, L.P. 12 Spring, TX United States

Recent patent applications by MA XIANG

XIANG MA from SPRING, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-25

US20240245178A1

Human necessities

Writing device packaging boxes

#2 | 2023-08-24

US20230266797A1

Physics

Lid display areas

#3 | 2023-03-23

US20230089955A1

Physics

PIN ASSIGNMENTS BASED ON VOLTAGE RANGES

#4 | 2023-01-26

US20230028263A1

Physics

CARD RETAINERS

#5 | 2022-07-21

US20220229474A1

Physics

CARD RETAINERS

#6 | 2022-07-07

US20220217870A1

Electricity

CIRCUIT BOARDS FOR ELECTRONIC DEVICES

#7 | 2022-07-07

US20220214732A1

Physics

POWER DELIVERY CONNECTORS

#8 | 2022-05-12

US20220147120A1

Physics

STOWABLE ACCESSORY DOCKS

#9 | 2021-11-25

US20210365399A1

Physics

Data link changes based on requests

#10 | 2021-10-28

US20210333828A1

Physics

MATEABLE COMPUTING DEVICES

#11 | 2021-06-03

US20210165501A1

Physics

CUSTOMIZED RADIO FREQUENCY IDENTIFICATION

#12 | 2021-01-28

US20210026505A1

Physics

EXECUTING ON-SCREEN DISPLAYS

#13 | 2020-03-12

US20200081505A1

Physics

THERMAL MODULES WITH CONDUCTIVE COVER PLATES

InventorID:

2671521 ⎘