Plano, Texas
United States
8
2024-11-14
The entities that hold a legal rights for patent applications filed by inventor Dry Robert Charles:
Robert Charles Dry from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
#2 | 2023-09-21Package architecture utilizing wafer to wafer bonding
#3 | 2022-10-06Package architecture utilizing wafer to wafer bonding
#4 | 2020-11-12Air-cavity semiconductor package with low cost high thermal carrier
#5 | 2020-10-29Semiconductor package with floating heat spreader and process for making the same
#6 | 2020-06-25Electronic package arrangements and related methods
#7 | 2020-05-21Structures for spatial power-combining devices
#8 | 2020-03-12Semiconductor package with floating heat spreader and process for making the same
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