Hsinchu
Taiwan
15
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor Tu Meng-Che:
Meng-Che Tu from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
#2 | 2025-11-06MULTIPLE POLYMER LAYERS AS THE ENCAPSULANT OF CONDUCTIVE VIAS
#3 | 2025-05-01Multiple Polymer Layers as the Encapsulant of Conductive Vias
#4 | 2025-04-24SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
#5 | 2025-02-13SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#6 | 2024-06-06SEMICONDUCTOR DEVICE
#7 | 2024-04-18Lithography
#8 | 2023-11-23Semiconductor package and methods of forming the same
#9 | 2023-03-02Lithography
#10 | 2023-01-19Package and method of manufacturing the same
#11 | 2021-09-23Semiconductor package and methods of forming the same
#12 | 2021-01-21Integrated fan-out package
#13 | 2020-09-10Semiconductor devices and methods of forming the same
#14 | 2020-04-30Semiconductor package and methods of forming the same
#15 | 2020-03-19Semiconductor devices, semiconductor packages and methods of forming the same
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