Kaohsiung
Taiwan
13
2022-06-16
The entities that hold a legal rights for patent applications filed by inventor Lu Chen-Fa:
Chen-Fa Lu from Kaohsiung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Buffer layer(s) on a stacked structure having a via
#2 | 2021-11-25Semiconductor structure with ultra thick metal and manufacturing method thereof
#3 | 2020-04-16Buffer layer(s) on a stacked structure having a via
#4 | 2019-08-15Semiconductor structure with ultra thick metal and manufacturing method thereof
#5 | 2019-03-14Semiconductor structure
#6 | 2018-10-04Stress monitoring device and method of manufacturing the same
#7 | 2018-02-22Buffer layer(s) on a stacked structure having a via
#8 | 2017-07-13Semiconductor structure and manufacturing method thereof
#9 | 2017-04-06Semiconductor structure with ultra thick metal and manufacturing method thereof
#10 | 2016-02-18Buffer layer(s) on a stacked structure having a via
#11 | 2015-01-01Method and apparatus to protect a wafer edge
#12 | 2014-05-15Plasma treatment for semiconductor devices
#13 | 2012-12-27Bump structure with barrier layer on post-passivation interconnect
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