Grenoble
France
34
2025-10-16
The entities that hold a legal rights for patent applications filed by inventor Bar Pierre:
Pierre Bar from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
IMAGE SENSOR AND ITS MANUFACTURING METHOD
#2 | 2025-06-26CONTACT PAD PROCESSING METHOD
#3 | 2025-06-12IMAGE SENSOR MANUFACTURING METHOD
#4 | 2025-05-22MANUFACTURING METHOD OF AN ELECTRONIC CIRCUIT COMPRISING CONTACT PADS
#5 | 2024-09-26METHOD FOR DICING A SEMICONDUCTOR WAFER
#6 | 2023-02-16IMAGE SENSOR MANUFACTURING METHOD
#7 | 2023-01-05ETCHING METHOD
#8 | 2020-07-02Etching method
#9 | 2019-07-11Method of etching a cavity in a stack of layers
#10 | 2017-08-17Process for fabricating an integrated circuit comprising at least one coplanar waveguide
#11 | 2016-11-24Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure
#12 | 2016-11-03Integrated circuit chip assembled on an interposer
#13 | 2016-07-14Shielded coplanar line
#14 | 2016-07-07THREE-DIMENSIONAL INTEGRATED STRUCTURE COMPRISING AN ANTENNA CROSS REFERENCE TO RELATED APPLICATIONS
#15 | 2016-04-07Process for fabricating an integrated circuit comprising at least one coplanar waveguide
#16 | 2015-09-24Integrated circuit chip assembled on an interposer
#17 | 2014-12-25Method for determining a three-dimensional stress field of an object, an integrated structure in particular, and corresponding system
#18 | 2014-12-11Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structure
#19 | 2014-03-20Method for manufacturing BAW resonators on a semiconductor wafer
#20 | 2014-01-16Semiconductor device comprising an integrated capacitor and method of fabrication
#21 | 2013-12-19Three-dimensional integrated structure comprising an antenna
#22 | 2013-11-28Shielded coplanar line
#23 | 2013-11-07Connection of a chip provided with through vias
#24 | 2013-06-06Method for forming an integrated circuit
#25 | 2012-12-20Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device
#26 | 2012-12-06Process for fabricating an integrated circuit comprising at least one coplanar waveguide
#27 | 2012-05-31Semiconductor device comprising a capacitor and an electrical connection via, and fabrication method
#28 | 2012-05-31Semiconductor device comprising a capacitor and an electrical connection via and fabrication method
#29 | 2012-05-03Transmission line for electronic circuits
#30 | 2011-12-08Method of adjustment during manufacture of a circuit having a capacitor
#31 | 2011-04-07Method of adjustment on manufacturing of a circuit having a resonant element
#32 | 2011-04-07METHOD FOR MANUFACTURING BAW RESONATORS ON A SEMICONDUCTOR WAFER
#33 | 2011-04-07Bragg mirror and BAW resonator with a high quality factor on the bragg mirror
#34 | 2011-04-07Method for manufacturing a monolithic oscillator with bulk acoustic wave (BAW) resonators
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