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Inventor profile of:

DONG SUB OH

City:

Busan

Country:

South Korea

Published Applications:

Last publication date:

2026-03-05

Top Assignees for applications by DONG SUB OH

The entities that hold a legal rights for patent applications filed by inventor OH DONG SUB:

SEMES CO., LTD. 8 Cheonan-si, South Korea
SEMES CO., LTD. 8 Chungcheongnam-do, South Korea

Recent patent applications by OH DONG SUB

DONG SUB OH from Busan, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-05

US20260066236A1

Electricity

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA

#2 | 2025-08-28

US20250273474A1

Electricity

METHOD AND SYSTEM FOR PROCESSING SUBSTRATE

#3 | 2024-12-12

US20240412951A1

Electricity

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

#4 | 2024-03-21

US20240096603A1

Electricity

APPARATUS FOR TREATING SUBSTRATE

#5 | 2023-10-05

US20230317419A1

Electricity

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA

#6 | 2023-10-05

US20230317415A1

Electricity

SUBSTRATE PROCESSING APPARATUS AND METHOD USING THE PLASMA

#7 | 2023-07-06

US20230215699A1

Electricity

METHOD OF TREATING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE

#8 | 2023-06-29

US20230207248A1

Electricity

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

#9 | 2023-06-22

US20230197412A1

Electricity

Apparatus and method for processing substrate using plasma

#10 | 2023-05-11

US20230148026A1

Electricity

Substrate treating method and substrate treating apparatus

#11 | 2023-05-11

US20230144896A1

Electricity

SUBSTRATE TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME

#12 | 2023-05-04

US20230136707A1

Electricity

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

#13 | 2022-03-24

US20220090861A1

Mechanical engineering

Substrate treating apparatus and substrate treating system comprising the same

#14 | 2022-03-17

US20220084829A1

Electricity

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND APPARATUS FOR PROCESSING SUBSTRATE USING PLASMA

#15 | 2022-03-10

US20220076925A1

Electricity

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA

#16 | 2021-09-16

US20210287877A1

Electricity

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

#17 | 2021-05-20

US20210151333A1

Electricity

Method for treating substrate and apparatus for treating substrate

#18 | 2021-01-14

US20210013049A1

Electricity

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

#19 | 2020-04-23

US20200122165A1

Performing operations; transporting

Liquid dispensing nozzle and substrate treating apparatus

InventorID:

2706139 ⎘