Eiichi ISHIDA

City:

Okayama

Country:

Japan

Published Applications:

Last publication date:

2023-09-28

Top Assignees for applications by Eiichi ISHIDA

The entities that hold a legal rights for patent applications filed by inventor ISHIDA Eiichi:

Eiichi ISHIDA from Okayama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

EMULSION COMPOSITION AND METHOD FOR PRODUCING SAME

SURFACE-MODIFIED FIBERS, REINFORCING FIBERS, AND MOLDED ARTICLE USING SAME

RESIN COMPOSITION AND MOLDED BODY THEREOF

RUBBER COMPOSITION AND TIRE THEREWITH

RESIN COMPOSITION AND METHOD FOR PRODUCING SAME

InventorID:

2707307 ⎘