Hirokuni OGIHARA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2020-05-07

Top Assignees for applications by Hirokuni OGIHARA

The entities that hold a legal rights for patent applications filed by inventor OGIHARA Hirokuni:

Hirokuni OGIHARA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Epoxy resin composition and electronic component device

Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device

InventorID:

2722997 ⎘