Daniel Schneider

City:

Bellikon

Country:

Switzerland

Published Applications:

Last publication date:

2020-05-07

Top Assignees for applications by Daniel Schneider

The entities that hold a legal rights for patent applications filed by inventor Schneider Daniel:

Daniel Schneider from Bellikon, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

Power semiconductor module with dimples in metallization layer below foot of terminal

Electric module with a fastening device

Semiconductor module

InventorID:

2726047 ⎘