Pasadena, California
United States
8
2025-05-08
The entities that hold a legal rights for patent applications filed by inventor LEE SEUNGJAE:
SEUNGJAE LEE from Pasadena, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PHOTONIC INTEGRATED CIRCUITS WITH CONTROLLED COLLAPSE CHIP CONNECTIONS
#2 | 2023-10-26PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYER
#3 | 2022-10-06Through mold via frame
#4 | 2022-01-20Photonic integrated circuits with controlled collapse chip connections
#5 | 2020-07-16Optical engine
#6 | 2020-07-09Co-packaged optics and transceiver
#7 | 2020-05-21Fan-out package with rabbet
#8 | 2019-10-17Electro-optical package and method of fabrication
2740310 ⎘