Chongqing
China
13
2025-03-06
The entities that hold a legal rights for patent applications filed by inventor Lee Minwoo:
Minwoo Lee from Chongqing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method
#2 | 2025-02-27Component Carrier With Embedded Interposer Laterally Between Electrically Conductive Structures of Stack
#3 | 2025-02-13Component Carrier and Method of Manufacturing the Same
#4 | 2025-01-09Component Carrier and Method of Manufacturing the Component Carrier
#5 | 2024-11-21Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both
#6 | 2024-10-03Component Carrier With Reinforcement Layer Structure and Manufacturing Method Using Two Temporary Carriers
#7 | 2023-08-17Component Carrier With Protruding Portions and Manufacturing Method
#8 | 2023-06-08Method of Manufacturing a Component Carrier Metal Trace and a Component Carrier
#9 | 2022-09-29Hybrid Core and Method of Manufacturing Component Carriers Using a Hybrid Core
#10 | 2021-06-24Component carrier with embedded interposer laterally between electrically conductive structures of stack and method for manufacturing the component carrier
#11 | 2020-06-25Component carrier having a component shielding and method of manufacturing the same
#12 | 2020-06-25Component carrier with included electrically conductive base structure and method of manufacturing
#13 | 2020-05-21Method of manufacturing a component carrier with an embedded cluster and the component carrier
2740331 ⎘