Inventor profile of:

Daisuke Kori

City:

Joetsu-shi

Country:

Japan

Published Applications:

62

Last publication date:

2026-05-21

Top Assignees for applications by Daisuke Kori

The entities that hold a legal rights for patent applications filed by inventor Kori Daisuke:

Recent patent applications by Kori Daisuke

Daisuke Kori from Joetsu-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-21
US20260144018A1
Electricity

COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN

#2 | 2026-04-09
US20260101693A1
Electricity

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, COMPOUND FOR FORMING ORGANIC FILM, AND AROMATIC CARBOXYLIC ANHYDRIDE

#3 | 2026-02-26
US20260056465A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND

#4 | 2026-01-15
US20260016751A1
Physics

LAMINATE, PREPARATION OF LAMINATE AND PATTERN FORMING PROCESS

#5 | 2025-12-25
US20250388711A1
Chemistry; metallurgy

SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS

#6 | 2025-12-11
US20250377597A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERN FORMING METHOD, AND POLYMER

#7 | 2025-12-04
US20250370335A1
Physics

SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS

#8 | 2025-08-28
US20250271763A1
Physics

Composition for Forming Organic Film, Method for Forming Organic Film and Patterning Process

#9 | 2025-02-20
US20250060670A1
Physics

Method For Forming Resist Underlayer Film And Patterning Process

#10 | 2025-01-30
US20250036029A1
Physics

Method For Forming Resist Underlayer Film And Patterning Process

#11 | 2025-01-30
US20250036024A1
Physics

Compound For Forming Metal-Containing Film, Composition For Forming Metal-Containing Film, Patterning Process, And Method For Manufacturing Compound For Forming Metal-Containing Film

#12 | 2023-09-07
US20230280655A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND

#13 | 2023-09-07
US20230280648A1
Physics

COMPOSITION FOR FORMING METAL OXIDE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING METAL OXIDE FILM

#14 | 2023-08-17
US20230260787A1
Electricity

COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN

#15 | 2023-08-03
US20230244147A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND AND POLYMER FOR FORMING ORGANIC FILM

#16 | 2023-06-01
US20230168585A1
Physics

RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

#17 | 2023-05-25
US20230161251A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND AND POLYMER FOR FORMING ORGANIC FILM

#18 | 2023-05-18
US20230152702A1
Physics

MATERIAL FOR FORMING FILLING FILM FOR INHIBITING SEMICONDUCTOR SUBSTRATE PATTERN COLLAPSE, AND METHOD FOR TREATING SEMICONDUCTOR SUBSTRATE

#19 | 2023-05-18
US20230152695A1
Physics

RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

#20 | 2023-05-04
US20230140810A1
Physics

MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM

#21 | 2023-04-20
US20230121798A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND

#22 | 2022-08-25
US20220269175A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

#23 | 2022-07-07
US20220214618A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER

#24 | 2022-07-07
US20220214617A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, COMPOUND, AND POLYMER

#25 | 2022-06-09
US20220179317A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#26 | 2022-05-26
US20220163890A1
Physics

Resist underlayer film material, patterning process, and method for forming resist underlayer film

#27 | 2022-04-07
US20220107566A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

#28 | 2021-12-23
US20210397092A1
Physics

Resist underlayer film material, patterning process, and method for forming resist underlayer film

#29 | 2021-10-07
US20210311395A1
Physics

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#30 | 2021-09-16
US20210286266A1
Physics

Material for forming organic film, method for forming organic film, patterning process, and compound

#31 | 2021-09-09
US20210278766A1
Physics

Coating-type composition for forming organic film, patterning process, polymer, and method for manufacturing polymer

#32 | 2021-09-02
US20210269597A1
Chemistry; metallurgy

Material for forming organic film, patterning process, and polymer

#33 | 2021-07-01
US20210198472A1
Chemistry; metallurgy

Material for forming organic film, method for forming organic film, patterning process, and compound

#34 | 2021-06-17
US20210181637A1
Physics

Material for forming organic film, method for forming organic film, patterning process, and compound

#35 | 2021-06-03
US20210163675A1
Chemistry; metallurgy

Material for forming organic film, patterning process, and polymer

#36 | 2021-01-14
US20210011384A1
Physics

Composition for forming organic film, patterning process, and polymer

#37 | 2021-01-07
US20210003920A1
Physics

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymer

#38 | 2020-12-10
US20200387071A1
Physics

Composition for forming organic film, patterning process, and polymer

#39 | 2020-12-03
US20200381247A1
Electricity

Material for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#40 | 2020-11-19
US20200363723A1
Physics

Composition for forming organic film, patterning process, and polymer

#41 | 2020-11-12
US20200356007A1
Physics

Composition for forming organic film, patterning process, and polymer

#42 | 2020-10-22
US20200333709A1
Physics

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#43 | 2020-10-22
US20200332062A1
Chemistry; metallurgy

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#44 | 2019-06-27
US20190198341A1
Electricity

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process

#45 | 2019-06-27
US20190194391A1
Chemistry; metallurgy

Method for producing dihydroxynaphthalene condensate and dihydroxynaphthalene condensate

#46 | 2019-06-27
US20190194102A1
Chemistry; metallurgy

METHOD FOR PURIFYING DIHYDROXYNAPHTHALENE

#47 | 2019-02-28
US20190067021A1
Electricity

Polymer and composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#48 | 2019-02-28
US20190064659A1
Physics

Composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, patterning process, and polymer

#49 | 2019-01-24
US20190027369A1
Electricity

Composition for forming organic film, patterning process, and resin for forming organic film

#50 | 2018-11-01
US20180315594A1
Electricity

Method of cleaning and drying semiconductor substrate

#51 | 2018-10-04
US20180284615A1
Physics

Resist underlayer film composition, patterning process, and method for forming resist underlayer film

#52 | 2018-10-04
US20180284614A1
Physics

Resist underlayer film composition, patterning process, and method for forming resist underlayer film

#53 | 2016-06-02
US20160154314A1
Physics

Rinse solution for pattern formation and pattern forming process

#54 | 2016-06-02
US20160154312A1
Physics

Rinse solution for pattern formation and pattern forming process

#55 | 2014-12-11
US20140363958A1
Electricity

Underlayer film-forming composition and pattern forming process

#56 | 2014-12-11
US20140363957A1
Electricity

Underlayer film-forming composition and pattern forming process

#57 | 2014-12-11
US20140363956A1
Electricity

Underlayer film-forming composition and pattern forming process

#58 | 2014-12-11
US20140363768A1
Chemistry; metallurgy

Naphthalene derivative, resist bottom layer material, and patterning process

#59 | 2013-06-06
US20130143162A1
Chemistry; metallurgy

Resist-protective film-forming composition and patterning process

#60 | 2012-10-04
US20120252218A1
Chemistry; metallurgy

Biphenyl derivative, resist bottom layer material, bottom layer forming method, and patterning process

#61 | 2012-03-15
US20120064725A1
Chemistry; metallurgy

Naphthalene derivative, resist bottom layer material, and patterning process

#62 | 2011-12-22
US20110311920A1
Chemistry; metallurgy

Naphthalene derivative, resist bottom layer material, resist bottom layer forming method, and patterning process

InventorID:

274664 ⎘