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Inventor profile of:

Paul BROWN

City:

Wakefield

Country:

Canada

Published Applications:

Last publication date:

2026-03-19

Top Assignees for applications by Paul BROWN

The entities that hold a legal rights for patent applications filed by inventor BROWN Paul:

ALCATEL 3 Paris, France
Nokia Solutions and Networks Oy 2 Espoo, Finland
ALCATEL LUCENT 1 Paris, France

Recent patent applications by BROWN Paul

Paul BROWN from Wakefield, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-19

US20260082484A1

Electricity

HIGH-DENSITY DECOUPLING CAPACITOR ROUTING OPTIMIZING CAPACITANCE WITH CONSIDERATION FOR HIGH-YIELD MANUFACTURING

#2 | 2025-08-07

US20250254788A1

Electricity

IN-LINE CAPACITOR MODULE

#3 | 2025-07-31

US20250247956A1

Electricity

ZERO CLEARANCE BACKDRILLED PRINTED CIRCUIT BOARDS

#4 | 2025-01-23

US20250031318A1

Electricity

PLATED VIA-IN-VIA VERTICAL CONNECTION

#5 | 2024-11-14

US20240381603A1

Electricity

PRE-ASSEMBLY WARPAGE PAIRING

#6 | 2024-10-17

US20240347432A1

Electricity

CONFIGURABLE WARPAGE CONTROL SPACERS

#7 | 2023-04-27

US20230132123A1

Electricity

SOLDER TRENCH

#8 | 2020-05-28

US20200170116A1

Electricity

Discrete component carrier

#9 | 2006-05-25

US20060110848A1

Electricity

Off-width pitch for improved circuit card routing

#10 | 2005-07-28

US20050162839A1

Electricity

Shared via decoupling for area arrays components

#11 | 2005-01-20

US20050014397A1

Electricity

Tailored interconnect module

InventorID:

2747668 ⎘