Inventor profile of:

Roy Yu

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

13

Last publication date:

2020-06-04

Top Assignees for applications by Roy Yu

The entities that hold a legal rights for patent applications filed by inventor Yu Roy:

Recent patent applications by Yu Roy

Roy Yu from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-06-04
US20200176262A1
Electricity

Nanostructure featuring nano-topography with optimized electrical and biochemical properties

#2 | 2020-06-04
US20200173953A1
Physics

Nanostructure featuring nano-topography with optimized electrical and biochemical properties

#3 | 2008-09-25
US20080230891A1
Electricity

Chip and wafer integration process using vertical connections

#4 | 2007-11-01
US20070252287A1
Electricity

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

#5 | 2006-12-14
US20060278998A1
Electricity

Integrated electronic chip and interconnect device and process for making the same

#6 | 2006-07-04
US10446461
-

Three-dimensional integrated CMOS-MEMS device and process for making the same

#7 | 2006-06-08
US20060121690A1
Electricity

Three-dimensional device fabrication method

#8 | 2006-02-14
US10299567
-

Thin film transfer join process and multilevel thin film module

#9 | 2005-08-11
US20050173800A1
Electricity

Process for making fine pitch connections between devices and structure made by the process

#10 | 2005-06-09
US20050121711A1
Electricity

Chip and wafer integration process using vertical connections

#11 | 2005-03-17
US20050056943A1
Electricity

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

#12 | 2005-03-17
US20050056942A1
Electricity

Method of fabricating integrated electronic chip with an interconnect device

#13 | 2005-02-15
US10465506
-

Chip and wafer integration process using vertical connections

InventorID:

2751172 ⎘