Jae Won CHOI

City:

Uiwang-si

Country:

South Korea

Published Applications:

Last publication date:

2014-12-04

Top Assignees for applications by Jae Won CHOI

The entities that hold a legal rights for patent applications filed by inventor CHOI Jae Won:

Cheil Industries Inc. 3 Gumi-si, Gyeongsangbuk-do, South Korea
Cheil Industries, Inc. 1 Gumi-si, Kyeongsangbuk-do, South Korea

Recent patent applications by CHOI Jae Won

Jae Won CHOI from Uiwang-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-04

US20140353848A1

Electricity

Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device

#2 | 2014-10-16

US20140306357A1

Electricity

Dicing die-bonding film and method of forming a cut on the dicing die-bonding film

#3 | 2014-07-10

US20140194555A1

Chemistry; metallurgy

Adhesive composition for semiconductor and adhesive film including the same

#4 | 2014-07-03

US20140186607A1

Chemistry; metallurgy

ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM

#5 | 2013-06-27

US20130165603A1

Chemistry; metallurgy

Adhesive Composition And Adhesive Film Comprising The Same

#6 | 2013-06-20

US20130154125A1

Chemistry; metallurgy

Adhesive film and electronic device including the same

#7 | 2013-06-06

US20130143363A1

Chemistry; metallurgy

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME

#8 | 2011-06-30

US20110159294A1

Chemistry; metallurgy

ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM USING THE SAME

#9 | 2011-06-30

US20110159284A1

Chemistry; metallurgy

ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND DIE ATTACH FILM

InventorID:

275155 ⎘