Tokyo
Japan
19
2013-06-06
The entities that hold a legal rights for patent applications filed by inventor YAMADA Junji:
Junji YAMADA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Resin sealed semiconductor device and manufacturing method therefor
#2 | 2012-05-17Stacked type semiconductor memory device and chip selection circuit
#3 | 2011-07-21Polyester Resin Container With Fracturable Portion And Its Production Method
#4 | 2011-06-23CIRCUIT SIMULATION APPARATUS AND TRANSIENT ANALYSIS METHOD FOR PERFORMING TRANSIENT ANALYSIS
#5 | 2010-04-22Electric power semiconductor device
#6 | 2009-11-19Semiconductor memory device
#7 | 2009-08-27Resin sealed semiconductor device and manufacturing method therefor
#8 | 2009-04-02Power semiconductor module
#9 | 2008-07-10Electric power semiconductor device
#10 | 2008-06-26Semiconductor device and power supply for the same
#11 | 2007-11-06Electric power semiconductor device
#12 | 2007-10-04Laminated memory having autonomically and sequentially activating operation
#13 | 2007-08-09Stacked semiconductor device
#14 | 2007-06-07Stacked type semiconductor memory device and chip selection circuit
#15 | 2007-05-24Memory bank arrangement for stacked memory
#16 | 2006-10-05Semiconductor device and insulating substrate utilizing a second conductor with a non-joint area
#17 | 2006-08-08Power semiconductor device
#18 | 2006-01-10Semiconductor power module
#19 | 2005-10-27Semiconductor device
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