Setsuo KIKUCHI

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2022-06-02

Top Assignees for applications by Setsuo KIKUCHI

The entities that hold a legal rights for patent applications filed by inventor KIKUCHI Setsuo:

Fuji Polymer Industries Co., Ltd. 3 Aichi, Japan
National Institute of Advanced Industrial Science and Technology 1 Tokyo, Japan

Recent patent applications by KIKUCHI Setsuo

Setsuo KIKUCHI from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-06-02

US20220169857A1

Chemistry; metallurgy

Thermally conductive silicone gel composition

#2 | 2020-12-03

US20200377728A1

Chemistry; metallurgy

Composite resin granules and method for producing the same, and thermally conductive resin molded body using composite resin granules and method for producing thermally conductive resin molded body

#3 | 2020-06-04

US20200176350A1

Electricity

Heat-conductive sheet, mounting method using same and bonding method using same

InventorID:

2753160 ⎘