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Inventor profile of:

Risa Miyazawa

City:

Isehara

Country:

Japan

Published Applications:

9

Last publication date:

2026-03-26

Top Assignees for applications by Risa Miyazawa

The entities that hold a legal rights for patent applications filed by inventor Miyazawa Risa:

  • INTERNATIONAL BUSINESS MACHINES CORPORATION 6 ARMONK, NY United States

Recent patent applications by Miyazawa Risa

Risa Miyazawa from Isehara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-26
US20260090463A1
Electricity

SEMICONDUCTOR DEVICE WITH MOISTURE DIFFUSIVE THROUGH GLASS VIA STRUCTURE

#2 | 2025-08-14
US20250259905A1
Electricity

UNDERFILL VACUUM PROCESS

#3 | 2024-01-04
US20240006371A1
Electricity

SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE

#4 | 2023-06-08
US20230178445A1
Electricity

Underfill vacuum process

#5 | 2023-06-08
US20230178404A1
Electricity

Silicon handler with laser-release layers

#6 | 2022-11-24
US20220375867A1
Electricity

Side pad anchored by next adjacent via

#7 | 2022-11-10
US20220359227A1
Electricity

Fabricating an interconnection using a sacrificial layer

#8 | 2021-07-08
US20210210454A1
Electricity

Prevention of bridging between solder joints

#9 | 2020-06-04
US20200176821A1
Electricity

Electron device stack structure

InventorID:

2753459 ⎘

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