Fishkill, New York
United States
13
2025-12-25
The entities that hold a legal rights for patent applications filed by inventor Singh Bhupender:
Bhupender Singh from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
UTILIZING FORMATE SHELLS FOR METAL STRUCTURES ON INTEGRATED CIRCUIT COMPONENTS
#2 | 2022-08-25Near tier decoupling capacitors
#3 | 2022-02-24High bandwidth module
#4 | 2021-10-14Enlarged conductive pad structures for enhanced chip bond assembly yield
#5 | 2021-09-16High bandwidth module
#6 | 2021-07-22Electronic apparatus having inter-chip stiffener
#7 | 2021-06-10Spacer for die-to-die communication in an integrated circuit and method for fabricating the same
#8 | 2021-04-08Alignment carrier for interconnect bridge assembly
#9 | 2021-03-11Polygon integrated circuit (IC) packaging
#10 | 2020-12-24Fins for enhanced die communication
#11 | 2020-11-12Direct attachment of capacitors to flip chip dies
#12 | 2020-10-01Spacer for die-to-die communication in an integrated circuit
#13 | 2020-06-11Stacked capacitors for use in integrated circuit modules and the like
2760599 ⎘