Peter Dietrich

City:

Roedermark

Country:

Germany

Published Applications:

Last publication date:

2020-06-25

Top Assignees for applications by Peter Dietrich

The entities that hold a legal rights for patent applications filed by inventor Dietrich Peter:

Peter Dietrich from Roedermark, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

InventorID:

2772075 ⎘