Osaka
Japan
15
2023-02-16
The entities that hold a legal rights for patent applications filed by inventor HATANAKA Itsuhiro:
Itsuhiro HATANAKA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET
#2 | 2019-08-01Pressure sensitive adhesive sheet, method for manufacturing thereof, and pressure sensitive adhesive film
#3 | 2019-08-01Pressure sensitive adhesive, curable pressure sensitive adhesive composition, pressure sensitive adhesive sheet and method for manufacturing thereof
#4 | 2013-11-21FOAM LAMINATED BODY FOR ELECTRICAL OR ELECTRONIC EQUIPMENT
#5 | 2013-11-14FOAM LAMINATE FOR ELECTRIC OR ELECTRONIC DEVICE
#6 | 2013-08-29RESIN FOAM SHEET AND RESIN FOAM MEMBER
#7 | 2013-03-28Resin composition for polyolefin resin foam, polyolefin resin foam and foamed sealing material
#8 | 2013-01-17RESIN FOAM AND FOAM SEALING MATERIAL
#9 | 2013-01-10Polyester elastomer foam and foam material
#10 | 2011-10-27RESIN FOAM AND FOAMED MEMBER
#11 | 2011-07-14Foam waterproofing material with a micro cell structure
#12 | 2011-01-06RESIN FOAM
#13 | 2010-12-16INORGANIC POWDER-CONTAINING RESIN COMPOSITION, AND A SUBSTRATE HAVING A DIELECTRIC LAYER FORMED THEREON
#14 | 2010-09-23IMPACT-ABSORBING MATERIAL
#15 | 2010-09-16FOAM DUSTPROOFING MATERIAL WITH A MICRO CELL STRUCTURE
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