Guy REDLER

DIE-TO-DIE AND CHIP-TO-CHIP INTERCONNECT CLOCK SKEW COMPENSATION

THERMAL SENSOR FOR INTEGRATED CIRCUIT

INTEGRATED CIRCUIT GLITCH DETECTION

INTEGRATED CIRCUIT SIMULATOR FOR DEGRADATION ESTIMATION AND TIME-OF-FAILURE PREDICTION

INTEGRATED CIRCUIT WORKLOAD, TEMPERATURE, AND/OR SUB-THRESHOLD LEAKAGE SENSOR

DIE-TO-DIE CONNECTIVITY MONITORING

ADAPTIVE FREQUENCY SCALING BASED ON CLOCK CYCLE TIME MEASUREMENT

INTEGRATED CIRCUIT DEGRADATION ESTIMATION AND TIME-OF-FAILURE PREDICTION USING WORKLOAD AND MARGIN SENSING

Loopback testing of integrated circuits

Die-to-die and chip-to-chip connectivity monitoring

DIE-TO-DIE CONNECTIVITY MONITORING WITH A CLOCKED RECEIVER

INTEGRATED CIRCUIT PAD FAILURE DETECTION

Die-to-die connectivity monitoring using a clocked receiver

Integrated circuit workload, temperature, and/or sub-threshold leakage sensor

Thermal sensor for integrated circuit

Memory device degradation monitoring

DETERMINATION OF UNKNOWN BIAS AND DEVICE PARAMETERS OF INTEGRATED CIRCUITS BY MEASUREMENT AND SIMULATION

ON-DIE THERMAL SENSING NETWORK FOR INTEGRATED CIRCUITS

Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing

Die-to-die connectivity monitoring

Integrated circuit I/O integrity and degradation monitoring

Die-to-die connectivity monitoring

Integrated circuit I/O integrity and degradation monitoring

Integrated circuit workload, temperature and/or subthreshold leakage sensor

Integrated circuit I/O integrity and degradation monitoring