Jun QI

City:

Hong Kong

Country:

Hong Kong

Published Applications:

Last publication date:

2022-10-20

Top Assignees for applications by Jun QI

The entities that hold a legal rights for patent applications filed by inventor QI Jun:

Jun QI from Hong Kong, HK has applied for patents for these inventions. The list has both pending applications and granted patents:

Detaching a die from an adhesive tape by air ejection

Heating of a substrate for epoxy deposition

InventorID:

2796237 ⎘