Keisuke MASUDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-03-13

Top Assignees for applications by Keisuke MASUDA

The entities that hold a legal rights for patent applications filed by inventor MASUDA Keisuke:

TOYOCOLOR CO., LTD. 3 Tokyo, Japan
TOYO INK SC HOLDINGS CO., LTD. 2 Tokyo, Japan
MITSUBISHI ELECTRIC CORPORATION 1 TOKYO, Japan
ARTIENCE CO., LTD. 1 Tokyo, Japan

Recent patent applications by MASUDA Keisuke

Keisuke MASUDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-03-13

US20250084231A1

Chemistry; metallurgy

MOLDED BODY FOR HOUSING, RESIN COMPOSITION FOR USE IN FORMING SAME, AND MASTERBATCH

#2 | 2024-05-09

US20240150542A1

Chemistry; metallurgy

THERMOPLASTIC RESIN COMPOSITION TO BE USED IN ELECTROMAGNETIC WAVE ABSORBER, AND MOLDED ARTICLE

#3 | 2023-09-14

US20230290550A1

Electricity

MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS

#4 | 2020-07-23

US20200230713A1

Performing operations; transporting

LENGTH MEASUREMENT CONTROL APPARATUS, MANUFACTURING SYSTEM, LENGTH MEASUREMENT CONTROL METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM STORING LENGTH MEASUREMENT CONTROL PROGRAM

InventorID:

2798588 ⎘