Daisuke MURANO

City:

Chuo-ku

Country:

Japan

Published Applications:

Last publication date:

2020-07-23

Top Assignees for applications by Daisuke MURANO

The entities that hold a legal rights for patent applications filed by inventor MURANO Daisuke:

Daisuke MURANO from Chuo-ku, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Polyamide fine particle, method for producing same, and polyamide fine particle composition

InventorID:

2799664 ⎘