Rensselaer, New York
United States
8
2022-02-17
The entities that hold a legal rights for patent applications filed by inventor Sil Devika:
Devika Sil from Rensselaer, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Interconnects including dual-metal vias
#2 | 2021-09-23Embedded metal contamination removal from BEOL wafers
#3 | 2021-07-29Large grain copper interconnect lines for MRAM
#4 | 2021-03-25MRAM devices containing a harden gap fill dielectric material
#5 | 2020-12-10ION IMPLANTATION ASSISTED CURING FOR FLOWABLE POROUS DIELECTRICS
#6 | 2020-12-10BOTTOM-UP CURING OF DIELECTRIC FILMS IN INTEGRATED CIRCUITS
#7 | 2020-07-30Interconnect with self-forming wrap-all-around barrier layer
#8 | 2020-07-23Forming high carbon content flowable dielectric film with low processing damage
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