Hsinchu
Taiwan
24
2025-11-20
The entities that hold a legal rights for patent applications filed by inventor CHEN Yu-Hsiang:
Yu-Hsiang CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
#2 | 2025-11-06THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
#3 | 2025-06-26STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
#4 | 2025-03-20THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
#5 | 2024-11-21ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE
#6 | 2024-11-07Back-End-Of-Line Devices
#7 | 2024-07-25THERMAL SENSOR DEVICE BY BACK END OF LINE METAL RESISTOR
#8 | 2024-06-13THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
#9 | 2024-01-18SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME
#10 | 2023-11-16Back-end-of-line devices
#11 | 2023-10-12Semiconductor device structure with resistive element
#12 | 2023-09-28ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE
#13 | 2023-08-24Method for manufacturing semiconductor structure with resistive elements
#14 | 2022-09-29Thermal dissipation in semiconductor devices
#15 | 2022-09-15Back-end-of-line devices
#16 | 2022-04-28Semiconductor device structure with resistive element
#17 | 2022-01-27Semiconductor devices and method for forming the same
#18 | 2021-10-28Thermal dissipation in semiconductor devices
#19 | 2021-08-19Interconnect level with high resistance layer and method of forming the same
#20 | 2021-08-12Semiconductor device structure with resistive elements
#21 | 2020-07-23Frequency doubling apparatus and method thereof
#22 | 2020-04-16Method for forming semiconductor device with resistive element
#23 | 2019-05-09Structure and formation method of semiconductor device with resistive element
#24 | 2019-05-09Structure and formation method of semiconductor device with resistive elements
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