Jun Yoshida

City:

Chiba

Country:

Japan

Published Applications:

Last publication date:

2023-05-25

Top Assignees for applications by Jun Yoshida

The entities that hold a legal rights for patent applications filed by inventor Yoshida Jun:

Jun Yoshida from Chiba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin composition, heat-shrinkable film, and container

Resin composition, heat-shrinkable film, and container

Block copolymer, its composition and film made of it

Block copolymer, composition thereof, and film made thereof

InventorID:

2806467 ⎘