Hefei
China
6
2021-09-16
The entities that hold a legal rights for patent applications filed by inventor LIN Dingyou:
Dingyou LIN from Hefei, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#2 | 2021-08-26SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
#3 | 2021-07-15Method of fabricating copper pillar bump structure with solder supporting barrier
#4 | 2021-07-15Wafer, semiconductor device and method for manufacturing the same
#5 | 2020-08-27Asymmetric FinFET in memory device, method of fabricating same and semiconductor device
#6 | 2020-07-30Memory transistor with cavity structure
2809707 ⎘